3DPTEK-J800P
Industrial-grade Binder Jetting glue jet equipment
Industrial equipment Digital manufacturing Complex structures Steady production
3DPTEK-J800P equipment is of a production type for the industries of MIM, molds, knives, etc. Implementation of the latest powdered single-cylinder structure, equipped with a V+ precision faller system, a double-sharp complex of high-condensed powdering systems, automatic nozzle cleaning, built-in air purification systems, etc., to operate quickly and flexibly to replace powder materials and glue ink to effectively guarantee production efficiency. Achieved: maximum print accuracy of 0.1 mm; 1,200 DPI resolution; Highest 10L/h print speed and 67% green density;
Note: The definition of “printing” in the above-mentioned “highest print accuracy ± 0.1 mm” consists of two parts: three-dimensional model input equipment for the production of raw materials; the entire defamin sintering process for the delivery of raw materials into a vacuum furnace; and ± 0.1 mm for the accuracy after the completion of the above-mentioned two steps, and L≤100 mm; Or it can reach ± 0.1% and L>100mm.
Process cover:The same model may be sprayed with a glue that is configured to cover the metal powder with advanced ceramic powder.
01 | high-resolution glue spray
Digitalization of complex metals or ceramics by high-precision ejection and stabilization powder.
02 | for mass production
No point-by-point laser melting is required, suitable for multiple layout and batch quantification, to increase output per unit time.
03 | materials switching flexibility
Material development and process validation could be supported by replacement of powder materials and glue systems under the project.
04 Complicated structural construction
Internal fluids, light quantifying structures, alien objects and customized parts suitable for traditional processing.
05 = complete burn route
Connected solidification, defamination, sintering and reprocessing processes can result in a chain of manufacture from powder to final parts.
06 The balance between R & D and production
Covering different stages of material research, product validation, small batch testing and industrial production.
| Device Model | 3DPTEK-J800P |
|---|---|
| Device main size | 2670×1850×2560 mm |
| Size | 800×500×400 mm |
| Equipment weight | About 4.2t |
| Headprint resolution | 400×400dpi /800×800dpi/ 1200×1200dpi |
| Size thickness | 0.03-0.2mm |
| Forming materials | 304/316 L/Cronium alloy/high temperature alloy/ titanium alloy/tungsten alloy/silic carbide, etc. |
3DPTEK-J800P may serve the following typical applications according to material, parts structure, precision and capacity requirements. Specific configurations and process routes should be assessed in conjunction with actual projects.
3C Electronic – Precision structural, distillation, functional and complex small parts
MIM and powder metallurgical – Metal raw, material validation and small and medium batch burning parts
Moot and knife. – Following structures, complex blades and high performance material parts
Advanced ceramics – Complex ceramic structures, functional ceramics and material process development
Scientific research and new materials – powders, glues, defaminized sinters and structural design validation