3DPTEK-J160R
Industrial-grade Binder Jetting glue jet equipment
Industrial equipment Digital manufacturing Complex structures Steady production
3DPTEK-J160R equipment is R & D equipment for universities, research institutes, enterprise research and development institutes, etc. This series of devices achieves a maximum print accuracy of 0.1 mm; 1,200 DPI resolution; 165cc/h print speed and 67% green density; A real scientific instrument.
Note: The definition of “printing” in the above-mentioned “highest print accuracy ± 0.1 mm” consists of two parts: three-dimensional model input equipment for the production of raw materials; the entire defamin sintering process for the delivery of raw materials into a vacuum furnace; and ± 0.1 mm for the accuracy after the completion of the above-mentioned two steps, and L≤100 mm; Or it can reach ± 0.1% and L>100mm.
Process cover:For metal and ceramic powder material development, research and development tests and small batch manufacturing.
01 | high-resolution glue spray
Digitalization of complex metals or ceramics by high-precision ejection and stabilization powder.
02 | for mass production
No point-by-point laser melting is required, suitable for multiple layout and batch quantification, to increase output per unit time.
03 | materials switching flexibility
Material development and process validation could be supported by replacement of powder materials and glue systems under the project.
04 Complicated structural construction
Internal fluids, light quantifying structures, alien objects and customized parts suitable for traditional processing.
05 = complete burn route
Connected solidification, defamination, sintering and reprocessing processes can result in a chain of manufacture from powder to final parts.
06 The balance between R & D and production
Covering different stages of material research, product validation, small batch testing and industrial production.
| Device Model | 3DPTEK-J160R |
|---|---|
| Device main size | 1200×1000×1440mm |
| Size | 160×65×65 mm |
| Equipment weight | About 0.65 T |
| Print Resolution | 400×400dpi /800×800dpi/ 1200×1200dpi |
| Size layer thick | 0.03-0.2mm |
| Forming materials | 304/316 L / copper alloy/high temperature alloy / titanium alloy/tungsten alloy, etc. |
3DPTEK-J160R may serve the following typical applications according to material, parts structure, accuracy and capacity requirements. Specific configurations and process routes should be assessed in conjunction with actual projects.
3C Electronic – Precision structural, distillation, functional and complex small parts
MIM and powder metallurgical – Metal raw, material validation and small and medium batch burning parts
Moot and knife. – Following structures, complex blades and high performance material parts
Advanced ceramics – Complex ceramic structures, functional ceramics and material process development
Scientific research and new materials – powders, glues, defaminized sinters and structural design validation